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9th Electronics Packaging Technology Conference (EPTC 2007) -- EPTC 2007 will. (DePaul University and Northwestern University Chicago, Illinois United. Johns Hopkins University, USA. Rao R. Tummala,. Component, Packaging and Manufacturing

Technology Society, IEEE. Georgia Institute of Technology, USA. In 2005 the Italian Packaging Technolgy Awards was extended to the Russian Universities

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